METALLIC COMPOSITES FOR THE 21st CENTURY

IGBT Baseplates
Insulated Gate Bipolar Transistors (IGBT) offer excellent switching efficiency for high power electronic components.  Applications include Hybrid or Electric Vehicles (HEV / EV), traction motor controls, and inverters for switch-mode power supplies in Alternative Energy, Uninterruptible Power Supply (UPS) and welding. 

MC-21 Al-SiC MMC provides lightweight, high reliability solutions for thermal management of these devices with high thermal conductivity and low coefficient of thermal expansion (CTE).  The unique properties of MC-21 MMC allows for a cost effective alternative BETWEEN copper and high-priced, traditional Al-SiC. 
MC-21's unique products and processes allow for value added solutions to your thermal management needs. 

  • Better reliability than Copper or Aluminum
  • Lighter weight than Copper
  • Much stiffer than Aluminum or Copper
  • Excellent wear and corrosion resistance
  • Cheaper than traditional Al-SiC producers
  • High volume production capability

Contact us today to learn how MMC30 with CTE of 14.5ppm/C· is the upgrade from copper you want without the high price of other Al-SiC providers.
IGBT baseplate plate thermal spreader low CTE ppm
Demonstration piece of MMC45 Al-SiC (CTE 10.5 ppm/C) with inset magnification showing the homogeneous microstructure

Table of Properties

   MMC 30
 MMC 45
Aluminum
 Copper  Other Al-SiC
 SiC (vol %)
 30
45
0
0
63
 Products Sheet/Cast
Cast
Sheet/Cast
Sheet
Preform
 Density (g/cc)
 2.80
2.90
2.70
8.90
3.10
CTE (ppm) 25-150 C
14.5
10.5
22.5
17.5
  8.5
Thermal Conductivity (W/mK)
175
 180
170
390
190
Specific Modulus (Stiffness)
40
60
27
15
60
Relative Price
$+
$+
¼$
$
$$$
    values listed in this table are typical values for comparison purposes only